Always Never Home

We help candidates land their dream Jobs, Internships, Grants, Scholarships and Graduate programs

Bond University International Stand Out Scholarship 2025 | 25% Tuition Fee Remission

Bond University International Stand Out Scholarship 2025 | 25% Tuition Fee Remission

Hey!!! I have 7 million in US stock investment. Here is how I did it.

Bond University International Stand Out Scholarship 2025: Overview

The Bond University International Stand Out Scholarship is designed for exceptional students who demonstrate strong academic performance and unique achievements. Available for both undergraduate and postgraduate applicants, this scholarship offers 25% tuition fee remission across a wide range of degree programs.

It is part of Bond University’s commitment to recognising and supporting standout international students who are ready to make a global impact.

Bond University International Stand Out Scholarship 2025: Eligibility

Applicants must:

  • Be an international student from an eligible country (see list below).

  • Have completed or be completing high school (for undergraduate entry) OR hold a degree (for postgraduate entry).

  • Apply for an eligible Bond University undergraduate or postgraduate degree program.

  • Demonstrate standout academic achievements.

  • Exclusions: Bond Medical Program, Doctor of Physiotherapy, Graduate Diploma of Legal Practice, Master of Psychology (Clinical), Master of Professional Psychology.

Eligible Countries

Some eligible countries include: Nigeria, Kenya, South Africa, India, China, Indonesia, the United States, the United Kingdom, Vietnam, Japan, France, Brazil, Sri Lanka, Pakistan, Malaysia, and many more across Asia, Africa, Europe, and the Pacific.

Benefits

  • 25% tuition fee remission for the entire duration of the program.

  • Available for both undergraduate and postgraduate degrees.

  • Flexible commencement: January, May, or September intakes.

  • Recognition as a Bond International Stand Out Scholar.

Fellowship/Program Components

  • Scholarship applied directly towards tuition fees.

  • Covers approved single or combined undergraduate or postgraduate degrees.

  • Access to academic and career support networks.

Application Requirements

  • Completed the Bond University application form for an eligible program.

  • Academic transcripts (high school or university).

  • Proof of strong academic achievement.

  • English language proficiency (where applicable).

Selection Criteria

  • Based on academic merit and evidence of standout achievements.

  • Consideration of leadership, extracurricular activities, or unique accomplishments may strengthen applications.

Application Process

  1. Apply for your preferred Bond undergraduate or postgraduate program.

  2. Scholarship eligibility will be automatically assessed when your program application is reviewed.

  3. If successful, you will receive both an admission and a scholarship offer.

  4. Accept both by the deadline specified in your offer letter.

Important Dates

  • Applications: Open year-round.

  • Intakes: January, May, September 2025.

  • Acceptance Deadline: Stated individually in each offer.

For more information and application: 

Visit the official website of the Bond University International Stand Out Scholarship 2025 | 25% Tuition Fee Remission

Bond University International Stand Out Scholarship 2025 | 25% Tuition Fee Remission
Share with someone
Scroll to top

Receive Job and Scholarship Alerts

X